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| BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HG635A-TRB Features: 1. Emitted Color : Green. 2. Lens Appearance : Water Clear. 3. Mono-color type. 4. 2.0x1.25x1.0mm(0805) standard package. 5. Suitable for all SMT assembly methods. 1.25(.049) 0.2 Cathode Mark 2.0(.079) 0.2 1.2(.047) LED die Package Dimensions: 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This product doesn't contain restriction 1.00 3 1.0(.039) 0.2 2-R0.05(.002) MAX. 2-R0.05(.002) MAX For reflow soldering 0.3(.012) 1.4(.055) 1.2(.047) 0.9(.035) 1.2(.047) Substance, comply ROHS standard. Cathode Mark 0.4(.016) 1.25(.049) 0.4(.016) Applications: 1. Automotive : Dashboards, stop lamps, turn signals. 2. 3. Backlighting : LCDs, Key pads advertising. Status indicators : Comsumer & industrial electronics. NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is 0.10mm (0.004") unless otherwise specified. 3.Specifications are subject to change without notice. 4. General use. Absolute Maximum Ratings(Ta=25) Parameter Power Dissipation Forward Current Peak Forward Current 1 Reverse Volage Operating Temperature Storage Temperature Soldering Temperature Symbol Pd IF IFP VR Topr Tstg Tsol Rating 120 30 100 5 -25~80 -30~85 See Page6 Unit mW mA mA V - 1 Condition for IFP is pulse of 1/10 duty and 0.1msec width. Ver.1.0 Page 1 of 7 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HG635A-TRB Electrical and optical characteristics(Ta=25) Parameter Forward Voltage Luminous Intensity Reverse Current Peak Wave Length Dominant Wave Length Spectral Line Half-width Veiwing Angle Symbol Vf Iv IR p d 21/2 Condition IF=20mA IF=20mA VR=5V IF=20mA IF=20mA IF=20mA IF=20mA Min. 94 520 - Typ. 3.2 180 525 35 120 Max. 3.6 1 530 - Unit V mcd A nm nm nm deg Typical Electro-Optical Characteristics Curves Fig.1 Relative intensity vs. wavelength 1.0 60 Fig.2 Forward current derating curve vs. ambient temperature 50 Relative radiant intensity Forward current (mA) 40 0.5 30 20 10 0 475 525 575 0 20 40 60 80 100 Wavelength (nm) Ambient temperature Ta( C) Fig.3 Forward current vs. forward voltage 50 3.0 Fig.4 Relative luminous intensity vs. ambient temperature 40 2.5 Relative Luminous intensity (Normalized @20mA) 1 2 3 4 5 Forward current (mA) 2.0 30 1.5 20 1.0 10 0.5 0 0 -40 -20 0 20 40 60 Forward voltage(V) Ambient temperature Ta( C) Fig.5 Relative luminous intensity vs. forward current 2.0 Fig.6 Radiation diagram 0 10 20 30 Relative luminous intensity (@20mA) Relative radiant intensity 1.5 40 1.0 0.9 0.8 50 60 70 0.7 80 90 1.0 0.5 0 10 20 30 40 50 0.5 0.3 0.1 0.2 0.4 0.6 Forward current (mA) Ver.1.1 Page 2 of 7 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HG635A-TRB Tapping and packaging specifications(Units: mm) USER DIRECTION OF FEED 1.3 0.1 1.42 0.1 ANODE START END 13.0 0.5 13.0 0.5 71.0 1 5.3 0.05 8.0 0.3 2.26 0.1 CATHODE 4.0 0.1 4.0 0.1 1.5 0.1 2.0 0.05 1.75 0.1 3.5 0.05 TRAILER LEADER 0.3 FIXING TAPE NOTE: 3000 pcs PER REEL Package Method:(unit:mm) 12 bag/box 3000 pcs/reel 200 Bar Code Label 245 220 185 220 Aluminum Foil Bag 645 6 box/carton 210 470 Ver.1.0 Page 3 of 7 179 1 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HG635A-TRB Bin Limits Intensity Bin Limits (At 20mA) BIN CODE Q R S T Min. (mcd) 82.0 120.0 180.0 280.0 Max. (mcd) 160.0 240.0 360.0 550.0 C o l o r B i n L i m i ts ( 2 0 m A ) BIN CODE 6 7 Min. (nm) 519 524 Max. (nm) 526 531 V F B i n L i m i ts ( 2 0 m A ) BIN CODE G H J K Min.(v) 2.75 Max.(v) 3.05 3.25 3.45 3.65 2.95 3.15 3.35 B IN x x x VF BIN CODE Color BIN CODE Intensity BIN CODE Ver.1.1 Page 4 of 7 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HG635A-TRB Reliability Test Classification Test Item Reference Standard Test Conditions Result Operation Life MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202:103B High Humidity JIS-C-7021 :B-11 Endurance Storage Test High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low :B-12 Temperature JIS-C-7021 Storage Temperature MIL-STD-202:107D Cycling MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4 Thermal Shock MIL-STD-202:107D Environmental MIL-STD-750:1051 Test MIL-STD-883:1011 Solder MIL-STD-202:201A Resistance MIL-STD-750:2031 JIS-C-7021 :A-1 Connect with a power If=20mA Ta=Under room temperature Test time=1,000hrs Ta=+655 RH=90%-95% Test time=240hrs High Ta=+855 Test time=1,000hrs Low Ta=-355 Test time=1,000hrs -35 ~ +25 ~ +85 ~ +25 60min 20min 60min 20min Test Time=5cycle -355 ~+855 20min 20min Test Time=10cycle Preheating 140-160,within 2 minutes. Operation heating 260(Max.), within 10seconds. (Max.) 0/20 0/20 0/20 0/20 0/20 0/20 0/20 Judgment criteria of failure for the reliability Measuring items Forward voltage Reverse current Luminous intensity Symbol VF ( V) IR(uA) Iv ( mcd ) Measuring conditions IF=20mA VR=5V IF=20mA Judgement criteria for failure Over Ux1.2 Over Ux2 Below SX0.5 Note: 1.U means the upper limit of specified characteristics. S means initial value. 2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. Ver.1.0 Page 5 of 7 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HG635A-TRB Soldering : 1. Manual Of Soldering The temperature of the iron tip should not be higher than 300(572) and Soldering within 3 seconds per solder-land is to be observed. 2. Reflow Soldering Preheating : 140~1605,within 2 minutes. Operation heating : 260(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching). 10 SEC. MAX. 3. DIP soldering (Wave Soldering) : Preheating : 120~150,within 120~180 sec. Operation heating : 2455 within 5 sec.260 (Max) Gradual Cooling (Avoid quenching). Handling : Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook. Temperature 140~160 260 MAX. 4 /SEC. MAX. 4 /SEC. MAX. OVER 2 MIN. Time Soldering heat Max. 260 120~150 245 5 within 5 sec. Temperature Preheat 120~180 sec. Time Ver.1.0 Page 6 of 7 |
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